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Technology for License or Sale

  The following items are propriety technologies owned by Megadawn Ltd. that are for sale or available for licensing. Price varies, contact us for details. Click the links for more detailed information.
 
Post Pads A new technology in chip packaging beyond BGA. Features very high I/O counts exceeding 6000 points/sq. in. Post pads allow high currents to be used in integrated circuits packaging. Also allows high thermal transfer from silicon die to the motherboard. Includes information on nano-chip tecnologies.

Please note that these items are not available for online purchase. Please contact us directly.

 

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